Integrated micro heat sink based on microchannels microfabricated onto silicon

Proceedings of the International Semiconductor Conference, CAS

Volumn 1, Issue , 2009, Pages 223-226

  Coraci, A ^a   Iancu, E ^a   Magdalena, Ioana Stanca ^a   Parvulescu, C ^a   Corici, O ^b  

^a NATIONAL INSTITUTE FOR RESEARCH AND DEVELOPMENT IN MICROTECHNOLOGIES   (Romania)

^b SCHLUMBERGER   (United States)

Author keywords

Characterization; Cooling; Microprocessing; Surface; Test structure

Indexed keywords

CU THIN FILM; ELECTRICAL CHARACTERIZATION; FORCED COOLING; INTEGRATED MICROSYSTEMS; MICRO HEAT SINK; MICRO PROCESSING; MICRO-FABRICATION TECHNIQUES; MICRO-FLUIDIC DEVICES; MICROFABRICATED; POWER RESISTANCE; POWER SEMICONDUCTOR DEVICES; SACRIFICIAL LAYER; SILICON SURFACES; SURFACE TEST; TEST STRUCTURE; THICK RESIST;

COOLING; COPPER; MICROFABRICATION; MICROSYSTEMS; PLATINUM; POWER ELECTRONICS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES; SILICON WAFERS; SURFACE STRUCTURE;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 77950151565     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SMICND.2009.5336565     Document Type: Conference Paper

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