Nanocrystalline Ni-W for wear-resistant coatings and electroforming

Journal of the Electrochemical Society

Volumn 157, Issue 4, 2010, Pages

  Auerswald, Janko ^a   Fecht, Hans Jörg ^b  

^a CSEM   (Switzerland)

^b UNIVERSITY OF ULM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION; INTERNAL STRESS; MICRO SYSTEMS TECHNOLOGIES; NANOCRYSTALLINES; PROCESSING CONDITION; THERMAL STABILITY; WEAR-RESISTANT; WEAR-RESISTANT COATING; YOUNG'S MODULUS;

COATINGS; ELECTROFORMING; NANOCRYSTALLINE ALLOYS; NANOCRYSTALLINE SILICON; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; THERMOGRAVIMETRIC ANALYSIS; TITANIUM; TITANIUM ALLOYS; TUNGSTEN; WEAR RESISTANCE;

THERMAL EXPANSION;

EID: 77949728836     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3291984     Document Type: Article

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