Pulse plating effects during Ni-W electrodeposition

Corrosion Prevention and Control

Volumn 46, Issue 3, 1999, Pages 71-76

  Lee, Sheng Long ^a   Lee, Yuang Fa ^a   Chang, Ming Hon ^a   Lin, Jing Chie ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS ALLOYS; BINARY ALLOYS; CORROSION RESISTANCE; CURRENT DENSITY; HARDNESS; NICKEL ALLOYS; SODIUM CHLORIDE; SURFACE ROUGHNESS; TUNGSTEN; WEAR OF MATERIALS;

NICKEL TUNGSTEN ALLOY; PULSE PLATING;

ELECTROPLATING;

COATING; CORROSION RESISTANCE; ELECTRODEPOSITION;

EID: 0040886233     PISSN: 00109371     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (13)

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4. W. Kim and R. Weil, 1989. Surface Coatings Technology, 38, 289.
5. A. Brenner, 1963. Electrodeposition of alloys: principles and practice. Academic Press, New York and London, 2, 347.
6. C.G. Final and F.L. Jones, 1931. Trans.Electrochem.Soc., 59, 461-481.
7. G.L. Davis and C.H.R. Gentry, 1956. Metallurgia., 53, 3-17.
8. M.L. Holt and D.A. Swalhem, 1942. Trans.Electrochem.Soc., 81, 251-265.
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11. M. Cherkaoui, E. Chassaing, and K. Vu Quang, 1987. Platings and Surface Finishing, 74, 10, 50.
12. J.C. Puippe and F. Leaman, 1986. Theory and Practice of Pulse Plating, AESF, Orlando, Florida. p358.
13. D.T. Gawne and U. Ma Mater, 1987. Science and Technology, 3, 228.