Effects of sputtering condition on thin films deposited by r.f. sputtering with a polyimide target

IEEJ Transactions on Fundamentals and Materials

Volumn 130, Issue 2, 2010, Pages 147-154

  Uemura, Akihiro ^a   Tanabe, Tomoya ^a   Iwamori, Satoru ^a  

^a KANAZAWA UNIVERSITY   (Japan)

Author keywords

FT IR; Polyimide; Sputtering condition; Thin film; XPS

Indexed keywords

ADHESION STRENGTHS; BULK MATERIALS; CHEMICAL BONDING STATE; COPPER SUBSTRATES; ELEMENTAL COMPOSITIONS; FRICTION COEFFICIENTS; PIN ON DISK; R.F. SPUTTERING; SPUTTERED THIN FILMS; SPUTTERING CONDITIONS; TEST APPARATUS; WATER DROPLETS; XPS;

ADHESION; BOND STRENGTH (MATERIALS); CHEMICAL BONDS; CONTACT ANGLE; COPPER; DURABILITY; FRICTION; HIGH PRESSURE EFFECTS; POLYIMIDES; SHEAR STRESS; SUBSTRATES; THIN FILM DEVICES; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

VAPOR DEPOSITION;

EID: 77949403289     PISSN: 03854205     EISSN: 13475533     Source Type: Journal    
DOI: 10.1541/ieejfms.130.147     Document Type: Article

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