Growth of Cu metal films at room temperature using catalyzed reactions

Chemistry of Materials

Volumn 22, Issue 5, 2010, Pages 1607-1609

  Kang, Sang Woo ^a   Yun, Ju Young ^a   Chang, Yun Hee ^b  

^a Korea Research Institute of Standards and Science   (South Korea)

^b Korea Research Institute of Chemical Technology   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYTIC ACTIVATION; CATALYZED REACTIONS; CU FILMS; CU(HFAC)2; DEPOSITION TEMPERATURES; DIRECT INTERACTIONS; HYDROGEN BONDING INTERACTIONS; LONE PAIR; LONE PAIR ELECTRONS; METAL ATOMS; METAL FILM; ORGANIC BASE; ROOM TEMPERATURE;

ATOMS; CARBON FILMS; FILM GROWTH; HYDROGEN BONDS; METALLIC FILMS; OXYGEN; PYRIDINE; STAINLESS STEEL; SURFACE PROPERTIES; SURFACE REACTIONS; SURFACE ROUGHNESS; TITANIUM; TITANIUM NITRIDE;

COPPER;

EID: 77949394615     PISSN: 08974756     EISSN: 15205002     Source Type: Journal    
DOI: 10.1021/cm902294e     Document Type: Article

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