Numerical simulation of a thermoviscoelastic frictional problem with application to the hot-embossing process for manufacturing of microcomponents

International Polymer Processing

Volumn 24, Issue 2, 2009, Pages 174-184

  Kabanemi, K K ^a   Marcotte, J P ^a   Hetu J F ^a   Worgull, M ^b   Heckele, M ^b  

^a NATIONAL RESEARCH COUNCIL CANADA   (Canada)

^b KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 77949300919     PISSN: 0930777X     EISSN: None     Source Type: Journal    
DOI: 10.3139/217.2227     Document Type: Article

References (19)

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