Fluid and thermal analysis of a microchannel electronics cooler using computational fluid dynamics

Applied Thermal Engineering

Volumn 30, Issue 8-9, 2010, Pages 948-961

  Dix, Joseph ^a   Jokar, Amir ^a  

^a WASHINGTON STATE UNIVERSITY   (United States)

Author keywords

Computational fluid dynamics; Electronics cooling; Laser; Microchannel; Semiconductor

Indexed keywords

COMPUTATIONAL SIMULATION; DIODE LASERS; ELECTRONICS COOLING; EXPERIMENTAL VALIDATIONS; FLUID FLOW; GEOMETRICAL DESIGNS; HEAT REJECTION; HIGH-POWER; HIGH-POWER ELECTRONIC DEVICES; KEY ISSUES; MICROCHANNEL COOLERS; MICROCHANNEL COOLING; SYMMETRICAL DESIGN; SYSTEM TEMPERATURE; THERMAL ANALYSIS; THERMAL DESIGNS; VIABLE SOLUTIONS;

COMPUTATIONAL FLUID DYNAMICS; COOLING; COOLING SYSTEMS; FLOW OF FLUIDS; FLUID DYNAMICS; FLUIDS; HEAT EXCHANGERS; LASER APPLICATIONS; MICROCHANNELS; OPTIMIZATION; POWER ELECTRONICS; PRESSURE DROP; SEMICONDUCTOR DIODES; THERMOANALYSIS;

SEMICONDUCTOR LASERS;

EID: 77649272776     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2010.01.007     Document Type: Article

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