Design of a test facility and micro-channel heat exchanger prototype for high power electronic components

Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005

Volumn PART B, Issue , 2005, Pages 209-214

  McGlen, Ryan J ^a   Lee, Jon ^a   Buffone, Cosimo ^b  

^a NEWCASTLE UNIVERSITY   (United Kingdom)

^b Aavid Thermacore Europe Ltd   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; DIGITAL SIGNAL PROCESSING; MICROPROCESSOR CHIPS; POWER ELECTRONICS; SERVERS; TEST FACILITIES;

ELECTRONIC PROCESSING CHIPS; MICROCHANNELS; SYSTEM PERFORMANCE; THERMAL LIMIT;

HEAT EXCHANGERS;

EID: 27744443695     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/icmm2005-75068     Document Type: Conference Paper

References (7)

1. Moore, G. E. (1965). "Cramming more components onto integrated circuits". Electronics 38(8).
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3. Azar, K. (2000). "The History of Power Dissipation." Electronics Cooling 6(1).
4. Intel (2004). Intel Processor Specification Finder Web Pages, http://processorfinder.intel.com
5. Qu, W., Mudawar, I., (2002). "Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink." International Journal of Heat and Mass Transfer 45(12): 2549-2565
6. Owhaib, W, Palm, B, (2004). "Experimental investigation of single-phase convective heat transfer in circular micorchannels" Experimental Thermal and Fluid Science 28 (105-110).
7. McGlen, R. Jachuck, R. Lin, S. (2004). "Integrated thermal management techniques for high power electronic devices" Applied Thermal Engineering 24(1143-1156)