Thermomechanical design of a microchannel cooled semiconductor laser diode array package

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3625, Issue , 1999, Pages 535-542

  Yu, E C ^a   Przekwas, A J ^a  

^a CFD RESEARCH CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; COMPUTATIONAL FLUID DYNAMICS; COMPUTER AIDED DESIGN; COMPUTER SIMULATION; COMPUTER SOFTWARE; HEAT TRANSFER; OPTOELECTRONIC DEVICES; SOLDERING; STRESS ANALYSIS; THERMAL EXPANSION; THERMAL STRESS; THERMOANALYSIS;

THERMAL EXPANSION COEFFICIENT;

SEMICONDUCTOR LASERS;

EID: 0032646933     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.356913     Document Type: Conference Paper

References (10)