Evaluation of the film formation and the charge transport mechanism of indium tin oxide nanoparticle films

Thin Solid Films

Volumn 518, Issue 12, 2010, Pages 3373-3381

  Mahajeri, M ^a   Voigt, M ^a   Klupp Taylor, R N ^a   Reindl, A ^a   Peukert, W ^a  

^a UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

Author keywords

Charge transport; Conductance; Dispersion; Indium tin oxide; Nanoparticles; Stability; Transmittance

Indexed keywords

BEFORE AND AFTER; CHARGE TRANSPORT; CHARGE TRANSPORT MECHANISMS; CONDUCTANCE DISPERSION; DIP COATING; FILM FORMATIONS; FILM STRUCTURE; FORMING GAS; INDIUM TIN OXIDE FILMS; INDIUM-TIN OXIDE NANOPARTICLES; LOW DENSITY; MAXIMUM DENSITY; NANO PARTICULATES; OPTICAL METHODS; SPECIFIC CONDUCTIVITY; STABILIZER CONCENTRATION; STRUCTURE FORMATIONS; THERMALLY ACTIVATED;

ANNEALING; CHARGE TRANSFER; INDIUM; ION EXCHANGE; NANOPARTICLES; OXIDE FILMS; PHOTOLITHOGRAPHY; SUSPENSIONS (FLUIDS); TIN; TITANIUM COMPOUNDS;

ITO GLASS;

EID: 77649227142     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.10.119     Document Type: Article

References (31)

1. Gordon R.G. MRS Bull. 25 (2000) 52
2. Lai F., Lin L., Gai R., Lin Y., and Huang Z. Thin Solid Films 515 (2007) 7387
3. Lauxa S., Kaisera N., Zöller A., Götzelmann R., Lauth H., and Bernitzki H. Thin Solid Films 335 (1998) 1
4. Königer T., Rechtenwald T., Al-Naimi I., Frick T., Schmidt M., and Münstedt H. J. Coat. Technol. Res. (April 21 2009) 1 Published online
5. Reindl A., Mahajeri M., Hanft J., and Peukert W. Thin Solid Films 517 (2009) 1624
6. Pauw L.J.v.d. Philips Res. Rep. 13 (1958) 1
7. Günther L., and Peukert W. Colloids Surf. A 225 (2003) 49
8. Gross M., Winnacker A., and Wellmann P.J. Thin Solid Films 515 (2007) 8567
9. Ederth J., Hultåker A., Heszler P., Niklasson G.A., Granqvist C.G., van Doorn A., van Haag C., Jongerius M.J., and Burgard D. Smart Mater. Struct. 11 (2002) 675
10. Günther L., Peukert W., Goerigk G., and Dingenouts N. J. Colloid Interface Sci. 294 (2006) 309
11. Günther L., and Peukert W. Chem. Ing. Tech. 73 (2001) 1439
12. Günther L., and Peukert W. Part. Part. Syst. Charact. 19 (2002) 312
13. Fabregat-Santiago F., Ferriols N.S., Garcia-Belmonte G., and Bisquert J. Appl. Phys. Lett. 80 (2002) 2785
14. Yan B.D., Meilink S.L., Warren G.W., and Wynblatt P. IEEE Trans. Comp. Hybrids Manuf. Technol. (1987) 247 CHMT-10
15. Ederth J., Heszler P., Hultåker A., Niklasson G.A., and Granqvist C.G. Thin Solid Films 445 (2003) 199
16. Sheng P., Sichel E.K., and Gittleman J.I. Phys. Rev. Lett. 40 (1978) 1197
17. Sheng P. Phys. Rev. B 21 (1980) 2180
18. Al-Dahoudi N., and Aegerter M.A. Thin Solid Films 502 (2006) 193
19. Gross M., Linse N., Maksimenko I., and Wellmann P.J. Adv. Eng. Mater. 11 (2009) 295
20. Guenther G., Schierning G., Theissmann R., Kruk R., Schmechel R., Baehtz C., and Prodi-Schwab A. J. Appl. Phys. 104 (2008) 034501
21. Prodi-Schwab A., Lüthge T., Jahn R., Herbig B., and Löbmann P. J. Sol-Gel Sci. Technol. 47 (2008) 68
22. Ederth J., Hultåker A., Niklasson C.A., Heszler P., Van Doorn A.R., Jongerius M.J., Burgard D., and Granqvist C.G. Appl. Phys. A 81 (2005) 1363
23. Shigeno E., Shimizu K., Seki S., Ogawa M., Shida A., Ide M., and Sawada Y. Thin Solid Films 411 (2002) 56
24. Ota R., Seki S., Ogawa M., Nishide T., Shida A., Ide M., and Sawada Y. Thin Solid Films 411 (2002) 42
25. Sohn M.H., Kim D., Kim S.J., Paik N.W., and Gupta S. J. Vac. Sci. Technol. A 21 (2003) 1347
26. George J., and Menon C.S. Surf. Coat Technol. 132 (2000) 45
27. Hamberg I., and Granqvist C.G. J. Appl. Phys. 60 (1986) R123
28. Tak Y.H., Kim K.B., Park H.G., Lee K.H., and Lee J.R. Thin Solid Films 411 (2002) 12
29. Joshi R.N., Singh V.P., and McClure J.C. Thin Solid Films 257 (1995) 32
30. Suzuki A., Matsushita T., Aoki T., Mori A., and Okuda M. Thin Solid Films 411 (2002) 23
31. In: Wöll C. (Ed). Physical and Chemical Aspects of Organic Electronics (2009), WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim