Effects of thinned multi-stacked wafer thickness on stress distribution in the wafer-on-a-wafer (WOW) structure

Materials Research Society Symposium Proceedings

Volumn 1156, Issue , 2009, Pages 163-168

  Kitada, H ^a   Maeda, N ^a   Fujimoto, K ^b   Suzuki, K ^b   Nakamura, T ^c   Ohba, T ^a  

^a UNIVERSITY OF TOKYO   (Japan)

^b DAI NIPPON PRINTING CO LTD   (Japan)

^c FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COPPER; DESIGN OF EXPERIMENTS; SENSITIVITY ANALYSIS; SILICON WAFERS; STRESSES; THERMAL EXPANSION;

3-DIMENSIONAL; ADHESIVE LAYERS; BEOL STRUCTURES; STRUCTURAL INTEGRATION; THERMAL EXPANSION COEFFICIENTS; THERMAL MECHANICAL STRESS; THIN SILICON WAFER; WAFER THICKNESS;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 77649086395     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-1156-d08-05-f06-05     Document Type: Conference Paper

References (7)

1. A. Jourdain, S. Stoukatch, P. De Moor, W. Ruythooren, S. Pargfrieder, B. Swinnen, and E. Beyne. Proceeding of International Interconnect Technology Conference, (2007) p 207.
2. F. Liu, R. R. Yu, A. M. Young, J. P. Doyle, X. Wang, L. Shi, K.-N. Chen, X. Li, D. A. Dipaola, D. Brown, C. T. Ryan, J. A. Hagan, K. H. Wong, M. Lu, X. Gu, N. R. Klymko, E. D. Perfecta, A. G. Merryman, K. A. Kelly, S. Purushothaman, S. J. Koester, R. Wisnieff, and W. Haensch Technical digest of IEDM, (2008) p 599.
3. Y. Kurita, S. Matsui, N. Takahashi, K. Soejima, M. Komuro, M. Itou, C. Kakegawa, M. Kawano, Y. Egawa, Y. Saeki, H. Kikuchi, O. Kato, A. Yanagisawa, T. Mitsuhashi, M. Ishino, K. Shibata, S. Uchiyama, J. Yamada, and H. Ikeda. Proceeding of ECTC, (2007) p 821.
4. P. Leduc, F. de Crécy, M. Fayolle, B. Charlet, T. Enot, M. Zussy, B. Jones, J.-C. Barbé, N. Kernevez, N. Sillon, S. Maitrejean, D. Louis, G. Passemard. Proceeding of International Interconnect Technology Conference, (2007) p 210.
5. C. Okoro, Y. Yang, B. Vandevelde, B. Swinnen, D. Vandepitte, B. Verlinden, I. De Wolf,. Proceeding of International Interconnect Technology Conference, (2008) p 16.
6. N. Maeda, H. Kitada, K. Fujimoto, K. Suzuki, T. Nakamura, and T. Ohba, Proc. of Advanced Metallization Conference, (2008) p 91.
7. T Ohba, N. Maeda, H. Kitada, K. Fujimoto, K. Suzuki, T. Nakamura, A. Kawai, K. Arai. Proceeding of Material for Advanced Metallization (2009) p 127.