New composites with high thermal conductivity and low dielectric constant for microelectronic packaging

Polymer Composites

Volumn 31, Issue 2, 2010, Pages 307-313

  Ling, Wei ^a   Gu, Aijuan ^a   Liang, Guozheng ^a   Yuan, Li ^a  

^a SOOCHOW UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALN; BINARY COMPOSITES; DIELECTRIC CONSTANTS; FILLER CONTENTS; HIGH THERMAL CONDUCTIVITY; LOW DIELECTRIC CONSTANTS; MICROELECTRONIC PACKAGING; SILICON DIOXIDE; TERNARY COMPOSITES;

ALUMINUM; FILLERS; MICROELECTRONICS; NITRIDES; PERMITTIVITY; RESINS; SILICA; SILICON OXIDES; SURFACE TREATMENT; THERMAL CONDUCTIVITY; THERMOANALYSIS;

ALUMINUM NITRIDE;

EID: 77249116780     PISSN: 02728397     EISSN: 15480569     Source Type: Journal    
DOI: 10.1002/pc.20805     Document Type: Article

References (28)

1. Z.H. Huang, P.P. Conway, and R.C. Thomson, Microelectron. Reliability, 47, 1997 (2006).
2. C.K. Thomas, S.H.Y. Yang, S.F. Tsai, and C.C. Juan, Compos. Sci. Technol., 62, 655 (2002).
3. S. Yu, P. Hing, and X. Hu, Compos. Part A: Appl. Sci. Manuf., 33, 289 (2002).
4. G.W. Lee, M. Park, J. Kim, J.I. Lee, and H.G. Yoon, Compos. Part A: Appl. Sci. Manuf., 37, 727 (2006).
5. P. Gonon, A. Sylvestre, J. Teysseyre, and C. Prior, J. Mater. Sci. Mater. Electron. 12, 81 (2001).
6. M.G. Todd and F.G. Shi, IEEE Trans. Compon. Packag. Technol., 26, 667 (2003).
7. K. Brownlee, P.M. Raj, S.K. Bhattacharya, K. Shinotani, C.P. Wong, and R.R. Tummala, in the 52nd Electronic Components and Technology Conference, IEEE, Piscataway, NJ, 676 (2002).
8. Y. Guo, Handbook of Moire Measurement, Chemical Press, Beijing, 123 (2004).
9. R. Tummala, P.M. Raj, V. Sundaram, Adv. Packag., 13, 26. (2004).
10. A.J. Gu, Compos. Sci. Technol., 66, 1749 (2006).
11. J.L. Wang, G. Liang, and W. Zhao, Polym. Eng. Sci., 46, 581 (2006).
12. D.A. Shimp and B. Chin, in Chemistry and Technology of Cyanate Ester Resins, I. Hamerton, Ed., Blackie Academic and Professional, Glasgow, Electrical properties of cyanate ester resins and their significance for applications, 230 (1994).
13. I.Y. Chien and M.N. Nguyen, Solid-State Technol., 37, 87 (1994).
14. S. Ising and J. Christenson, in IPC 32nd Annual Meeting, Interconnecting & Packaging Electron Circuits, Lincolnwood, IL, 792 (1989).
15. T.J. Wooster, Compos. Part A: Appl. Sci. Manuf., 35, 75 (2004).
16. P. Bujard, G. Kuhnlein, S. Ino, and T. Shiobara, IEEE Trans. Compon. Packag. Manuf. Technol. A, 17, 527 (1994).
17. Y. Abe, K. Yamada, N. Abe, F. Tanaka, and T. Fujiki, in Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Components Failure Analysis, Institute of Electrical and Electronics Engineers Computer Society, Piscataway, NJ 08855-1331, 3 (2006).
18. S. Yu, P. Hing, and X. Hu, Compos Part A: Appl. Sci. Manuf., 33, 289 (2001).
19. Y. Xu and D.D.L. Chung, Compos. Part A: Appl. Sci. Manuf., 32, 1749 (2001).
20. D.H.P. Hasselman, J. Compos. Mater., 21, 508 (1987).
21. D.A.G. Bruggeman, Ann. Phys., 24, 636 (1935).
22. L.E. Nielsen, J. Appl. Polym. Sci., 17, 3819 (1973).
23. D.W. Sundstrom, J. Appl. Polym. Sci., 16, 3159 (1972).
24. M.S. Ozmusul and R.C. Picu, Polym. Compos., 23, 110 (2002).
25. H.T. Vo and F.G. Shi, Microelectron J., 33(56), 409 (2002).
26. I. Fisher, W.D. Kaplan, and M. Eizenberg, J. Appl. Phys., 95, 5762 (2004).
27. K.A. Malini, E.M. Mohammed, S. Sindhu, P.A. Joy, S.K. Date, S.D. Kulkarni, P. Kurian, and M.R. Anantharaman, J. Mater. Sci., 36, 5551 (2001).
28. P. Kurian, E.M. Mohammed, K.A. Malini, and M.R. Anantharaman, Mater. Res. Bull., 37, 753 (2002).