Dielectric properties of epoxy/silica composites used for microelectronic packaging, and their dependence on post-curing

Journal of Materials Science: Materials in Electronics

Volumn 12, Issue 2, 2001, Pages 81-86

  Gonon, P ^a   Sylvestre, A ^a   Teysseyre, J ^b   Prior, C ^b  

^a CNRS   (France)

^b STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON BLACK; CURING; ELECTRONICS PACKAGING; MICROELECTRONIC PROCESSING; NATURAL FREQUENCIES; PERMITTIVITY; RELAXATION PROCESSES; SILICA; TEMPERATURE;

LOSS FACTOR; POST-MOLD CURING;

EPOXY RESINS;

EID: 0035244851     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1011241818209     Document Type: Article

References (19)

1. Anelastic and dielectric effects in polymeric solids