Thermal and electrical behavior of polyimide/silica hybrid thin films

Polymer Engineering and Science

Volumn 50, Issue 3, 2010, Pages 520-529

  Hamciuc, Elena ^a   Hamciuc, Corneliu ^a   Olariu, Marius ^b  

^a PETRU PONI INSTITUTE OF MACROMOLECULAR CHEMISTRY   (Romania)

^b GHEORGHE ASACHI TECHNICAL UNIVERSITY OF IASI   (Romania)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CONTACT ANGLE; DYNAMIC MECHANICAL ANALYSIS; GLASS TRANSITION; POLYIMIDES; POLYMER FILMS; SCANNING ELECTRON MICROSCOPY; SILICA; SOL-GELS; THIN FILMS;

ELECTRICAL BEHAVIORS; OXYDIPHTHALIC ANHYDRIDES; POLY AMIC ACIDS; POLYCONDENSATION REACTIONS; POLYIMIDE FILM; POLYIMIDE-SILICA HYBRID THIN FILMS; SOL-GEL TECHNIQUE; SOLUTION POLYCONDENSATION; SYNTHESISED; THERMAL BEHAVIOURS;

COUPLING AGENTS;

EID: 76949104952     PISSN: 00323888     EISSN: 15482634     Source Type: Journal    
DOI: 10.1002/pen.21562     Document Type: Article

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