Thermal assisted direct bonding between structured glasses for lab-on-chip technology

Microsystem Technologies

Volumn 15, Issue 12, 2009, Pages 1873-1877

  Chen, Qiuping ^a   Chen, Qiuling ^a   Milanese, Daniel ^a   Ferraris, Monica ^a  

^a POLITECNICO DI TORINO   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

A-THERMAL; BONDED INTERFACE; DIRECT BONDING; FLAT GLASS; LAB-ON-CHIP TECHNOLOGY; LOW COSTS; MASS PRODUCTION; MICRO-FLUIDIC DEVICES; OPTIMISATIONS; SEM; SHEAR STRENGTH TESTS; VICKERS HARDNESS MEASUREMENTS;

FLUIDIC DEVICES; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; VICKERS HARDNESS;

GLASS;

EID: 76449108181     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-009-0911-5     Document Type: Article

References (12)

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