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We used a wet etching method whose rate was estimated by using the atomic force microscopy and the surface profiler. We checked this etching rate by measuring the resistance of mesa diodes comprising GaMnAs/AlAs/ p+ GaAs (001) with the toGaMnAs layer etched with various etching time, where the resistance became large when it was perfectly etched.
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We used a wet etching method whose rate was estimated by using the atomic force microscopy and the surface profiler. We checked this etching rate by measuring the resistance of mesa diodes comprising GaMnAs/AlAs/ p+ GaAs (001) with the top GaMnAs layer etched with various etching time, where the resistance became large when it was perfectly etched.
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9
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76449090817
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There is a small current path through the underlying GaAs:Be layer and the AlAs barrier as indicated by dotted path in Fig., but we neglected this path. We also neglected the resistance of the AlMnAs barrier just beneath the ring-shaped QW electrode, because it is much smaller than that beneath the TOP electrode due to the large difference in area size between the TOP and QW electrodes.
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There is a small current path through the underlying GaAs:Be layer and the AlAs barrier as indicated by dotted path in Fig., but we neglected this path. We also neglected the resistance of the AlMnAs barrier just beneath the ring-shaped QW electrode, because it is much smaller than that beneath the TOP electrode due to the large difference in area size between the TOP and QW electrodes.
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