|
Volumn 58, Issue 6, 2010, Pages 2282-2290
|
Ceramic processing strategies for thick films on copper foils
|
Author keywords
Copper; Electroceramics; Ferroelectricity; Perovkskites; Sintering
|
Indexed keywords
BASE METALS;
CERAMIC PROCESSING;
COERCIVE FIELD;
COPPER FOILS;
DIELECTRIC PERMITTIVITIES;
DIELECTRIC RESPONSE;
ELECTROCERAMICS;
ELECTROPHORETIC DEPOSITIONS;
FERROELECTRIC PROPERTY;
FUNCTIONAL OXIDES;
HIGH SINTERING TEMPERATURES;
ISOSTATIC PRESSING;
LEAD-ZIRCONATE-TITANATE FILMS;
LOSS TANGENT;
MULTIPLE APPLICATIONS;
PEROVKSKITES;
POST-DEPOSITION;
PZT FILM;
PZT POWDERS;
REMANENT POLARIZATION;
SINTERING TEMPERATURES;
CERAMIC MATERIALS;
ELECTROPHORESIS;
FERROELECTRIC FILMS;
FERROELECTRICITY;
PIEZOELECTRIC ACTUATORS;
PIEZOELECTRIC MATERIALS;
SEMICONDUCTING LEAD COMPOUNDS;
SINTERING;
THICK FILMS;
COPPER;
|
EID: 76349104833
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/j.actamat.2009.12.016 Document Type: Article |
Times cited : (5)
|
References (32)
|