Electrophoretic deposition of materials

Annual Review of Materials Science

Volumn 29, Issue , 1999, Pages 327-352

  Van Der Biest, Omer O ^a   Vandeperre, Luc J ^a  

^a UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC FIELD EFFECTS; ELECTROPHORESIS; ELECTROPHORETIC COATINGS; FIBERS; LAMINATES; POROUS MATERIALS; REACTION KINETICS; SUSPENSIONS (FLUIDS);

ELECTROPHORETIC DEPOSITION; ELECTROPHORETIC SUSPENSIONS; LAMINATED MATERIALS; WOVEN FIBER PREFORMS;

ELECTRODEPOSITION;

EID: 0041581151     PISSN: 00846600     EISSN: None     Source Type: Book    
DOI: 10.1146/annurev.matsci.29.1.327     Document Type: Book

References (114)

1. Heavens SN. 1990. In Advanced Ceramic Processing and Technology, ed. JGP B inner, 7:255-83. Park Ridge, NJ: Noyes
2. Hiemenz PC. 1986. Principles of Colloid and Surface Chemistry. New York: Dekker, 815 pp. 2nd. ed.
3. Pierce PE. 1981, J. Coat. Techn. 53(672): 52-67
4. Eberhard J. 1997. Galvano-Organo 66(678):621-23
5. Lamb VA, Reid WE. 1960. Plating (3):291-96
6. Engelhardt Th, Rijenen P, Hellkuhl L, Kaup F, Warnke H. 1990. Mitt. Ver. Dtsch. Emailfachleute 38(4):37-48
7. Engelhardt Th, Rijenen P, Hellkuhl L, Kaup F, Warnke H. 1990. Mitt. Ver. Dtsch. Emailfachleute 38(5):60-74
8. Engelhardt Th, Rijenen P, Hellkuhl L, Kaup F, Warnke H. 1990. Mitt. Ver. Dtsch. Emailfachleute 38(6):86-91
9. Engelhardt Th, Rijenen P, Hellkuhl L, Kaup F, Warnke H. 1990. Mitt. Ver. Dtsch. Emailfackleute 38(7):86-91
10. Engelhardt Th, Rijenen P, Hellkuhl L, Kaup F, Warnke H. 1990. Mitt. Ver. Dtsch. Emailfachleute, 38(8):105-16
11. Engelhardt Th, Rijenen P, Hellkuhl L, Kaup F, Warnke H. 1990. Mitt. Ver. Dtsch. Emailfachleute, 38(9):120-124
12. Ortner M. 1964. Plating (9):885-89
13. Barraclough M, Bolton NE, Collins AH, Andrews JH. 1967. IEEE Trans. Magnet. 3(3):531-34
14. Shane MJ, Talbot JB, Kinney BG, Sluzky E, Hesse KR. 1994. J. Colloid Int. Sci. 165:334-40
15. Shane MJ, Talbot JB, Schreiber RD, Ross CL, Sluzky E, Hesse KR. 1994. J. Colloid Int. Sci. 165:325-33
16. Siracuse JJ, Talbot JB, Sluzky E, Hesse KR. 1990. J. Electrochem. Soc. 137(1): 346-48
17. Sussman A, Ward TJ. 1981. RCA Rev. 42(6):178-97
18. Miziguchi J, Matsumura M, Suzuki M, Yamato H. 1991. J. Electrochem. Soc. 138(10):2942-46
19. Nojima H, Koba M, Shintaku H, Nagata M. 1991. Jpn. J. Appl. Phys. 30(7): L1166-68
20. Hein M, Peiniger M, Mahner E, Müller G, Piel H, et al. 1989. Physica C 162:111-12
21. Hein M, Peiniger M, Piel H, Ponto L, Becks M, Klein U. 1989. J. Appl. Phys. 66(12):5940-43
22. Chu CT, Dunn D. 1989. Appl. Phys. Lett. 55(5):492-94
23. Sharma AD, Sen A, Maiti HS. 1993. Ceram. Int. 19:65-70
24. Woolf LD, Fagaly RL, Raggio WA, Elsner FE, Fisher MV, et al. 1991. Appl. Phys. Lett. 58(5):534-36
25. Massoud E. 1979. Interceram 2:117-19
26. Mihailescu M, Emandi M, Vancea V, Marcu M. 1991. Interceram 40(3):165-70
27. Aveline M. 1966. Ind. Céram. 581.28-31
28. Boncoeur M, Carpenter S. 1972. Ind. Ceram. 648:79-81
29. Chronberg MS, Händle F. 1978. Interceram 1:33-34
30. Andrews JM, Dracass J, Collins AH, Cornish DC. 1969. Proc. Brit. Ceram. Soc. 12:211-29
31. Nass R, Schmidt H, Storch W, Harbach F, Neeff R, Nienburg H. 1992. In Ceramic Powder Processing Science, ed. H Hausner, GL Messing, S Hirano, pp. 625-32, Heidelberg: Bovery
32. Jean JH 1995. Mater. Chem. Phys. 40: 285-90
33. Ferrari B, Farinas JC, Moreno R. 1998. Presented at World Ceramics Congress and Forum on New Materials, Florence, Italy
34. Vandeperre L, Van der Biest O, Bouyer F, Persello J, Foissy A. 1997. J. Eur. Ceram. Soc. 17(2):373-76
35. Vandeperre LJ, Van der Biest O, Bouyer F, Foissy A. 1998. Ceram. Bull. 77(1):53-58
36. Wittwer H, Kruger HG. 1995. Ber DKG 72(9):556-60
37. Moritz K, Reetz T. 1993. Ber DKG 70(7):348-50
38. Moritz K, Reetz T. 1993. In Third Euroceramics, ed. P Duran, JF Fernandez, 1:425-30. Castellón de la Plana, Spain: Faenza Editrice
39. Kennedy JH, Foissy A. 1975. J. Electrochem. Soc. 122(4):482-86
40. Powers RW. 1986. Ceram. Bull. 65(9): 1270-77
41. Nicholson PS, Sarkar P, Huang X. 1993. J. Mater. Sci. 28:6274-78
42. Bissinger M, Prakash O, Sarkar P, Nicholson PS. 1994. Ceram. Sci. Eng. Proc. 15:1084-92
43. Ferrari B, Sanchez-Herencia AJ, Moreno R. 1998. Mater. Lett. 35:370-74
44. Fischer R, Fischer E, De Portu G, Roncari E. 1995. J. Mater. Sci. Lett. 14:25-27
45. Vandeperre L, Van der Biest O, Clegg WJ. 1997. In Key Engineering Materials, 127:567-74
46. Vandeperre L, Van der Biest O. 1998. Silicates Ind. 62(5):87-91
47. Vandeperre L, Van der Biest O. 1998. SiC laminates with porous interlayers produced by EPD. Presented at 100th Ann. Meet. Am. Ceram. Soc. Cincinnati, OH
48. Sarkar P, Nicholson PS, Huang X. 1993. J. Am. Ceram. Soc. 76(4):1055-56
49. Sarkar P, Datta S, Nicholson PS. 1997. Composites Part B 28:49-56
50. Zhao C. Vandeperre L, Vleugels J, Van der Biest O. 1998. J. Mater. Sci. Lett. 17:1453-55
51. Nicholson PS, Sarkar P, Dana S. 1996. Ceram. Bull. 75(11):48-51
52. Scala LC, Sandor JE. 1968. Electrochem. Technol. 6(11-12):434-37
53. Gal-Or L, Haber S, Liubovich S. 1992. J. Electrochem. Soc. 139(4):1078-81
54. Ishihara T, Takita Y, Sato K. 1996. J. Am. Ceram.Soc. 79(4):913-19
55. Streckert HH, Norton KP, Katz JD, Freim JO. 1997. J. Mater. Sci. 32:6429-33
56. Kooner S. 1995. Mater. Challenge (8):27-29
57. Kawai C, Wakamatsu S. 1996. J. Mater. Sci. 31:2165-70
58. Boccaccini AR, Ponton CB, MacLaren I, Lewis MH. 1997. J. Eur. Ceram. Soc. 17:1545-50
59. Boccaccini AR, Trusty PA. 1998. J. Mater. Sci. 33:933-38
60. James RO, Davis JA, Leckie JO. 1978. J. Colloid Int. Sci. 65(2):331-44
61. Lyklema J. 1984. J. Colloid Int. Sci. 99(1): 109-17
62. Ferrari B, Moreno R. 1997. J. Eur. Ceram. Soc. 17:549-56
63. Wang G, Nicholson PS, Sarkar P. 1997. J. Am. Ceram. Soc. 80(4):965-72
64. Powers RW. 1975. J. Electrochem. Soc. 122(4):482-86
65. Fisch HA, 1972. J. Electrochem. Soc. 119(1):57-64
66. Fessenden RJ, Fessenden JS. 1986. Organic Chemistry, Monterey, CA: Brooks-Cole. 3rd ed.
67. Labib ME, Williams R. 1986. Colloid Polym. Sc. 264:533-41
68. Labib ME, Williams R. 1984. J. Colloid Int. Sci. 97(2):356-66
69. Jensen WB. 1978. Chem. Rev. 78(1):1-21
70. Okuyama M, Haggerty JS, Garvey G. Ring TA. 1989. J. Am. Ceram. Soc. 72(10):1918-24
71. Bolger JC. 1981. In Acid-Base Interactions, ed. KL. Mitchel. New York: Elsevier
72. Vandeperre L. 1998. Electrophoretic shaping for ceramic laminated composites. PhD thesis, Katholieke Univ., Leuven, Belgium. 220 pp.
73. Vandeperre L, Van der Biest O. 1999. J. Eur. Ceram. Sci. Submitted
74. Vandeperre L, Zhao C, Van der Biest O. 1999. 6th Conf. Eur. Ceram. Soc. Brighton, UK. In press
75. Kennedy JH, Foissy A. 1977 J. Am. Ceram. Soc. 60(1):33-36
76. Blanco Lopez MC, Rand B, Riley F. 1996. Key Eng. Mater. 132-136:305-8
77. Hamaker HC, Verwey EJW. 1940. Trans. Farad, Soc. 36:180-85
78. Koelmans H. 1955. Philips Res. Rep. 10:161-93
79. Grillon F, Fayeulle D, Jeandin M. 1992. J. Mater. Sci. Lett. 11:272-75
80. Sarkar P, Nicholson PS. 1996. J. Am. Ceram. Soc 79(8):1987-2002
81. Russ BE, Talbot JB. 1998. J. Electrochem. Soc. 145(4):1253-56
82. Bouyer F, Foissy A. 1999. J. Am. Ceram. Soc. In press
83. Brown DR, Salt FW. 1965. J. Appl. Chem. 15(1):40-48
84. Sarkar P, Nicholson PS, Prakash O, Wang G. 1994. Ceram. Sci. Eng. Proc. 15(5):1019-27
85. Sheppard SE. 1927. Trans. Am. Electrochem. Soc. 52.47-82
86. Sarkar P, Huang X, Nicholson PS. 1993. Ceram. Eng. Sci. Proc. 14:707-17
87. Hamaker HC. 1940. Trans. Farad. Soc. 36:279-87
88. Gutierrez CP, Wallace TC, Mosley JR. 1962. J. Electrochem. Soc. 109:923-27
89. Sarkar P, Nicholson PS. 1995. J. Am. Ceram. Soc. 78(11):3165-66
90. Zhang Z. 1995. J. Am. Ceram. Soc. 78(11):3167-68
91. Dunbar JC, Mitchell TJ. 1953 J. Sci. Food Agr. 4:190-96
92. Ferrari B, Moreno R. 1995. In Fourth EuroCeramics, ed. C. Galassi, 1:421-28. Faenza, Italy. Gruppo Editoriale Faenza Editrice
93. Vandeperre LJ, Van der Biest OO. 1998. In Innovative Processing and Synthesis of Ceramics, Glasses, and Composites, Ceram. Proc., ed. NP Bansal, KV Logan, JP Singh, Ceram. Trans. Vol. 85. Westerville OH: Am. Ceram. Soc.
94. Bockris JOM, Reddy AKN. 1973. In Modern Electrochemistry, New York: Plenum Rosseta. 1432 pp. Vol. 1 & 2
95. Moritz K, Muller E. 1997. Werkstoffund Verfahrenstechnik (DGM) 563-68
96. Kuwabara K, Noda Y. 1993. J. Mater. Sc. Lett. 28:5257-61
97. Mizuguchi J, Muchi T, Sumi K. 1983. J. Electrochem. Soc. 130(9):1819-25
98. Wakamatsu KS. 1995. J. Mater. Sci. Lett. 14:467-69
99. Furman VV, Gaiduchenko GK, Vlastuk RZ, Deimontovich VB. 1983. Porosh. Metall. 251(11):83-87
100. Valdes JL, Huggins H, Mitchel, JW, Mucha JA, Seibles L. 1991. J. Electrochem. Soc. 138(2):635-36
101. Zhitomirsky I. 1998. Mater. Lett. 37(9): 72-78
102. Mahapatra AK, Dhananjayan N. 1981. Trans. Ind. Inst. Metals, 34(6),495-500
103. Hill CGA, Rees ALG, Lovering PE. 1947. Trans. Farad. Soc. 43:407-17
104. Pearlstein F. Gallacio A, Wick R. 1963. J. Electrochem. Soc. 110(7):843-46
105. Giersig M, Mulvaney P. 1993. J. Phys. Chem. 97(24):6334-36
106. Standish JV, Boerio FJ. 1980. J. Coat. Technol. 52(663):29-39
107. Nagai M, Takuma Y, Yamashita K, Umegaki T. 1993. J. Am. Ceram. Soc. 76(1): 253-55
108. Caley WF, Flengas SN. 1976. Can. Met. Quart. 15(4):375-82
109. Hang KW, Anderson WM, Andrus J. 1981. RCA Rev. 42(6):159-77
110. Baumgartner CE, Grimaldi JJ, DeCarlo VJ, Glugla PG. 1985. J. Electrochem. Soc. 132(1):57-63
111. Hirayama C, Berg D. 1963. Electrochem. Technol. 1(7-8):224-27
112. Hosseinbabaei F, Raissidehkordi B. 1998. Proc. 9th CIMTEC Conf. TECHNA Srl, Faenza, Italy. In press
113. Grosso PF, Rutherford RE, Sargent DE. 1970. J. Electrochem. Soc. 117(11):1456-59
114. Williams EW, Jones K, Griffiths J, Roughley DJ, Bell JM, et al. 1979. Solar Cells 1:357-66