The microstructure and mechanical properties of SiCp-reinforced copper matrix composites by hot pressing

Journal of Composite Materials

Volumn 44, Issue 3, 2010, Pages 347-354

  Wang, Changchun ^a   Min, Guanghui ^b   Kang, Suk Bong ^c  

^a LINYI UNIVERSITY   (China)

^b SHANDONG UNIVERSITY   (China)

^c Korea Institute of Material Science   (South Korea)

Author keywords

Bending strength; Brinell hardness; Electroless copper plating; SiCp Cu composite

Indexed keywords

ANNEALING TREATMENTS; BRINELL HARDNESS; COATED POWDERS; COPPER MATRIX COMPOSITE; ELECTROLESS COPPER PLATING; FRACTURE BEHAVIOR; FRACTURE MECHANISMS; MICROSTRUCTURE AND MECHANICAL PROPERTIES; PEAK VALUES; QUASI CLEAVAGE FRACTURE; QUASI-CLEAVAGE; REINFORCEMENT CONTENT; SIC POWDER; SICP/CU COMPOSITE;

BENDING STRENGTH; BRITTLE FRACTURE; COPPER; COPPER PLATING; ELECTROPLATING; HOT PRESSING; MECHANICAL PROPERTIES; METALLIC MATRIX COMPOSITES; MICROSTRUCTURE; REINFORCEMENT; SILICON CARBIDE; TITRATION; VOLUME FRACTION; WELDS;

HARDNESS;

EID: 76049125243     PISSN: 00219983     EISSN: 1530793X     Source Type: Journal    
DOI: 10.1177/0021998309347575     Document Type: Article

References (10)

1. Zweben, C. (1992). Metal-matrix Composites for Electronics Packaging, JOM, 44 (7). 15-23.
2. Zhang, L., Qu, X., Duan, B., Xinbo He, Shubin Ren and Mingli Qin (2008). Microstructure and Thermo-mechanical Properties of Pressureless Infiltrated SiCp/Cu Composites, Compos. Sci. Technol., 68: 2731-2738.
3. Rado, C., Drevet, B. and Eustathopoulos, N. (2000). Role of Compound Formation in Reactive Wetting: The Cu/SiC System, Acta Mater., 48: 4483-4491.
4. Wayne, J.R., Palmer, M., Wang, C. and Liu, Y. (2004). Packaging Materials and Approaches for High Temperature SiC Power Devices, Adv. Microelectron., 31 (1). 8-10.
5. Beffort, O., Long, S.Y. and Cayron, C. (2007). Alloying Effects on Microstructure and Mechanical Properties of High Volume Fraction SiC-particle Reinforced Al-MMCs Made by Squeeze Casting Infiltration, Compos. Sci. Technol., 67: 737-745.
6. Shu, K.M. and Tu, G.C. (2003). The Microstructure and the Thermal Expansion Characteristics of Cu/SiCp Composites, Mater. Sci. Eng., A, 349: 236-247.
7. Schubert, T., Brendel, A., Schmid, K., Koeck, Th., Ciupinski, L., Zielinski, W., Weibgarber, T. and Kieback, B. (2007). Interfacial Design of Cu/SiC Composites Prepared by Powder Metallurgy for Heat Sink Applications, Composites: Part A, 38: 2398-2403.
8. Zweben, C. (1998). Advances in Composite Materials for Thermal Management in Electronic Packaging, JOM, 50 (6). 47-51.
9. Moustafa, S.F., Abdel-Hamid, Z. and Abd-Elhay, A.M. (2002). Copper Matrix SiC and Al2O3 Particulate Composites by Powder Metallurgy Technique, Mater. Lett., 53: 244-249.
10. Wang, C., Min, G. and Kang, S.-B. (2006). Fabrication, Microstructure and Properties of SiCp/Cu Heat Sink Materials, Rare Metals, 25: 232-236.