Fabrication, microstructure and properties of SiCp/Cu heat sink materials

Rare Metals

Volumn 25, Issue 6 SUPPL. 2, 2006, Pages 232-236

  WANG, Changchun ^a,b,c   MIN, Guanghui ^a   KANG, Suk bong ^b  

^a SHANDONG UNIVERSITY   (China)

^b Korea Institute of Machine and Materials   (South Korea)

^c LINYI UNIVERSITY   (China)

Author keywords

coefficient of thermal expansion; electroless copper plating; heat sink material; thermal conductivity

Indexed keywords

COPPER PLATING; ELECTROLESS PLATING; MICROSTRUCTURE; THERMAL CONDUCTIVITY; THERMAL EXPANSION; VOLUME FRACTION;

COATED POWDERS; ELECTROLESS COPPER PLATING; HEAT SINK MATERIALS; UNCOATED POWDERS;

HEAT SINKS;

EID: 42949132785     PISSN: 10010521     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1001-0521(08)60088-1     Document Type: Article

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