Al/Ni self-propagating exothermic film for MEMS application

Materials Science Forum

Volumn 638-642, Issue , 2010, Pages 2142-2147

  Namazu, T ^a   Inoue, S ^a  

^a UNIVERSITY OF HYOGO   (Japan)

Author keywords

Al Ni multilayer film; Bonding strength; Exothermic reaction; Four point bending test; MEMS; Packaging; Solder bonding

Indexed keywords

BINARY ALLOYS; EXOTHERMIC REACTIONS; HEAT CONDUCTION; LEAD-FREE SOLDERS; MEMS; MULTILAYER FILMS; PACKAGING; SILICON WAFERS; SILVER ALLOYS; SOLDERING; TIN ALLOYS;

AL/NI MULTILAYERS; AL/NI REACTIVE FILMS; BONDED SI WAFERS; BONDING STRENGTH; CONTACT CONDITIONS; FOUR-POINT BENDING TEST; MEMS APPLICATIONS; SOLDER BONDING;

ALUMINUM ALLOYS;

EID: 75849129117     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/MSF.638-642.2142     Document Type: Conference Paper

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