Highly efficient and low-cost top-emitting organic light-emitting diodes for monochromatic microdisplays

Organic Electronics

Volumn 11, Issue 3, 2010, Pages 407-411

  Xie, Guohua ^a   Xue, Qin ^a   Chen, Ping ^a   Tao, Chen ^a   Zhao, Chunmei ^a   Lu, Jianhua ^a   Gong, Zhaoxin ^a   Zhang, Tianyu ^a   Huang, Ran ^b   Du, Huan ^b   Xie, Wenfa ^a   Hou, Jingying ^a   Zhao, Yi ^a   Liu, Shiyong ^a  

^a JILIN UNIVERSITY   (China)

^b INSTITUTE OF MICROELECTRONICS   (China)

Author keywords

Electrical doping; Low cost; OLED microdisplay; Trapping

Indexed keywords

COSTS; ELECTRONIC EQUIPMENT; ENERGY EFFICIENCY; LOW POWER ELECTRONICS; LUMINANCE;

COMMERCIAL PRODUCTIONS; DOPED HOLE-INJECTING LAYERS; HIGH VOLTAGE CMOS PROCESS; LOW COSTS; LOW-POWER CONSUMPTION; MICRODISPLAYS; ORGANIC LIGHT EMITTING DIODES(OLEDS); TRAPPING;

ORGANIC LIGHT EMITTING DIODES (OLED);

EID: 75449119889     PISSN: 15661199     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.orgel.2009.11.019     Document Type: Article

References (29)

1. Sun Y., Giebink N.C., Kanno H., Ma B., Thompson M.E., and Forrest S.R. Nature 440 (2006) 908
2. Pfeiffer M., Forrest S.R., Leo K., and Thompson M.E. Adv. Mater. 14 (2002) 1633
3. D' Andrade B.W., and Forrest S.R. Adv. Mater. 16 (2004) 1585
4. Reineke S., Lindner F., Schwartz G., Seidler N., Walzer K., Lüssem B., and Leo K. Nature 459 (2009) 234
5. Meerheim R., Walzer K., He G., Pfeiffer M., and Leo K. Proc. SPIE 6192 (2006) 61920P
6. Levy G.B., Evans W., Ebner J., Farrell P., Hufford M., Allison B.H., Wheeler D., Lin H., Prache O., and Naviasky E. IEEE J. Solid State Circ. 37 (2002) 1879
7. Ghosh A.P. Proc. SPIE 4464 (2002) 1
8. Armitage D., Underwood I., and Wu S.-T. Introduction to microdisplays (2006), John Wiley & Sons, Chichester
9. Voegl U., Kreye D., Reckziegel S., Törker M., Grillberger C., and Amelung J. Proc. SPIE 6477 (2007) 647703
10. Lee C.A., Jin S.H., Kwon H.I., Cho I.W., Kong J., Lee C.J., Lee M.W., Kyung J.W., Lee J.D., and Park B.-G. J. Inform. Display 5 (2004) 28
11. Here, we refer to p and n doping as "electrical doping" due to their impact on the conductivity of the carriers injecting or/and transporting layers. To avoid confusion with the admixture of emissive dyes with a host which is also denoted as doping, we refer to doping in emissive layer as "optical doping" which usually associates with the emissive colors and spectra.
12. Pfeiffer M., Forrest S.R., Zhou X., and Leo K. Org. Electron. 4 (2003) 21
13. He G., Pfeiffer M., Leo K., Hofmann M., Birnstock J., Pudzich R., and Salbeck J. Appl. Phys. Lett. 85 (2004) 3911
14. Huang Q., Walzer K., Pfeiffer M., Lyssenko V., He G., and Leo K. Appl. Phys. Lett. 88 (2006) 113515
15. Matsushima T., and Adachi C. Appl. Phys. Lett. 89 (2006) 253506
16. Schwartz G., Reineke S., Walzer K., and Leo K. Appl. Phys. Lett. 92 (2008) 053311
17. Matsushima T., and Adachi C. Appl. Phys. Lett. 92 (2008) 063306
18. Meerheim R., NItsche R., and Leo K. Appl. Phys. Lett. 93 (2008) 043310
19. Kim S.Y., Jeon W.S., Park T.J., Pode R., Jang J., and Kwon H.K. Appl. Phys. Lett. 94 (2009) 133303
20. Kanno H., Giebink N.C., Sun Y., and Forrest S.R. Appl. Phys. Lett. 89 (2006) 023503
21. Giebink N.C., and Forrest S.R. Phys. Rev. B 77 (2008) 235215
22. Xie G., Meng Y., Wu F., Tao C., Zhang D., Liu M., Xue Q., Chen W., and Zhao Y. Appl. Phys. Lett. 92 (2008) 093305
23. Nüesch F., Berner D., Tutiscaron E., Schaer M., Ma C., Wang X., Zhang B., and Zuppiroli L. Adv. Funct. Mater. 15 (2005) 323
24. Pfeiffer M., Leo K., Zhou X., Huang J.S., Hofmann M., Werner A., and Blochwitz-Nimoth J. Org. Electron. 4 (2003) 89
25. Wang Q., Ding J., Cheng Y., Wang L., and Ma D. J. Phys. D: Appl. Phys. 42 (2009) 065106
26. Lee C.-C., Chang M.-Y., Huang P.-T., Chen Y.C., Chang Y., and Liu S.-W. J. Appl. Phys. 101 (2007) 114501
27. Jeong C.H., Lim J.T., Kim M.S., Lee J.H., Bae J.W., and Yeom G.Y. Org. Electron. 8 (2007) 683
28. Charles H.K., Mach K.J., Lehtonen S.J., Francomacaro A.S., DeBoy J.S., and Edwards R.L. Microelectron. Reliab. 43 (2003) 141
29. Harman G. Wire Bonding in Microelectronics: Materials, Processes, Reliability and Yield (1997), McGraw-Hill