Deposition behavior of volatile acidic contaminants on metallic interconnect surfaces

Solid State Phenomena

Volumn 103-104, Issue , 2005, Pages 365-368

  Fontaine, Hervé ^a   Veillerot, Marc ^a   Danel, Adrien ^a  

^a CEA LETI   (France)

Author keywords

Aluminum; AMC; Copper; HBr; HCl; HF; Sticking coefficient

Indexed keywords

EID: 31744440908     PISSN: 10120394     EISSN: 16629779     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/SSP.103-104.365     Document Type: Conference Paper

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