Deformation behavior at room temperature of W-80vol%Cu composite

International Journal of Refractory Metals and Hard Materials

Volumn 22, Issue 2-3, 2004, Pages 87-93

  Hiraoka, Yutaka ^a   Hanado, Hideaki ^a   Inoue, Takeshi ^a  

^a OKAYAMA UNIVERSITY OF SCIENCE   (Japan)

Author keywords

Localized deformation; Microstructure; Morphology; Porosity; W Cu composite

Indexed keywords

DEFORMATION; ELECTRONIC EQUIPMENT; EROSION; INDENTATION; MICROSTRUCTURE; MORPHOLOGY; POROSITY; PRESSING (FORMING); SCANNING ELECTRON MICROSCOPY; SINTERING; THERMAL CONDUCTIVITY; THERMAL EFFECTS; THERMAL EXPANSION; TUNGSTEN ALLOYS; WEAR RESISTANCE; WELDING;

DIAMOND SHAPED INDENTATIONS; LOCALIZED DEFORMATION; PLASTIC STRAIN; W-CU COMPOSITE;

COMPOSITE MATERIALS;

EID: 2442646482     PISSN: 02634368     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijrmhm.2004.01.002     Document Type: Article

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