Effects of TiC on microstructures and properties of CuW electrical contact materials

Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering

Volumn 36, Issue 5, 2007, Pages 817-821

  Yang, Xiaohong ^a   Fan, Zhikang ^a   Liang, Shuhua ^a   Xiao, Peng ^a  

^a XI'AN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Microstructure; Properties; TiC; Vacuum breakdown; W Cu alloys

Indexed keywords

COPPER ALLOYS; ELECTRIC CONDUCTIVITY; INFILTRATION; MICROSTRUCTURE; POWDER METALLURGY; TITANIUM CARBIDE;

ELECTRICAL CONTACT MATERIALS; PROPERTIES; TUNGSTEN COPPER ALLOYS; VACUUM BREAKDOWN;

TUNGSTEN ALLOYS;

EID: 34547767548     PISSN: 1002185X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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