Analysis of fixed abrasive pads with a nano-sized diamond for silicon wafer polishing

Advanced Materials Research

Volumn 76-78, Issue , 2009, Pages 410-415

  Shih, Cheng Yi ^a   Tso, Pei Lum ^a   Sung, James C ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b KINIK Company   (Taiwan)

Author keywords

Fixed abrasive pad; Nano sized diamond; Silicon wafer polishing

Indexed keywords

DIAMOND ABRASIVE; DISTILLED WATER; ENVIRONMENTAL PROBLEMS; FIXED ABRASIVE PADS; FIXED ABRASIVES; FREE ABRASIVE; HIGH HARDNESS; NANO-SIZED; NANO-SIZED DIAMOND; PAD CONDITIONER; PAD MATERIAL; POLISHING PADS; PRIMARY FUNCTIONS; WAFER SURFACE; WORK PIECES;

ABRASION; DIAMONDS; POLISHING; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SURFACE ROUGHNESS; SURFACES;

ABRASIVES;

EID: 73949127512     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.76-78.410     Document Type: Conference Paper

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