Deformation and material removal rate in polishing silicon wafers

Journal of Materials Processing Technology

Volumn 140, Issue 1-3 SPEC., 2003, Pages 641-645

  Zarudi, I ^a   Han, B S ^a  

^a UNIVERSITY OF SYDNEY   (Australia)

Author keywords

Deformation mechanism; Explicit formulation; Material removal; Silicon wafer

Indexed keywords

ATOMIC FORCE MICROSCOPY; BRITTLE FRACTURE; DEFORMATION; MOLECULAR DYNAMICS; POLISHING; SURFACE ROUGHNESS; TRANSMISSION ELECTRON MICROSCOPY;

MATERIAL REMOVAL RATES (MRR);

SILICON WAFERS;

EID: 0041782684     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(03)00754-4     Document Type: Conference Paper

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