Vacuum-assisted aerosol deposition of a low-dielectric-constant periodic mesoporous organosilica film

Advanced Materials

Volumn 22, Issue 1, 2010, Pages 99-102

  Wang, Wendong ^a   Grozea, Daniel ^a   Kim, Ara ^a   Perovic, Douglas D ^a   Ozin, Geoffrey A ^a  

^a UNIVERSITY OF TORONTO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

AEROSOL DEPOSITION; DELIVERY TECHNIQUES; MESOSTRUCTURED FILMS; PERIODIC MESOPOROUS ORGANOSILICA THIN FILMS; PERIODIC MESOPOROUS ORGANOSILICAS; SEMICONDUCTOR CHIPS; SEMICONDUCTOR INDUSTRY; VAPOR PHASE;

ATMOSPHERIC AEROSOLS; BUILDING MATERIALS; DEPOSITION; FILMS; MECHANICAL PROPERTIES; RESPIRATORY MECHANICS; SEMICONDUCTOR DEVICE MANUFACTURE; VACUUM;

DIELECTRIC MATERIALS;

SILICON DIOXIDE;

AEROSOL; ARTICLE; CHEMISTRY; ELECTRIC CONDUCTIVITY; POROSITY; VACUUM;

AEROSOLS; ELECTRIC CONDUCTIVITY; POROSITY; SILICON DIOXIDE; VACUUM;

EID: 73949092729     PISSN: 09359648     EISSN: None     Source Type: Journal    
DOI: 10.1002/adma.200901498     Document Type: Article

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