The copper sulfide coating on polyacrylonitrile with a chelating agent of ethylenediaminetetraacetic acid by an electroless deposition method and its EMI shielding effectiveness

Journal of Applied Polymer Science

Volumn 115, Issue 1, 2010, Pages 570-578

  Chen, Yen Hung ^a   Huang, Chi Yuan ^a   Roan, Ming Lih ^b   Lai, Fu Der ^c   Chen, Kan Nan ^d   Yeh, Jen Taut ^e  

^a TATUNG UNIVERSITY   (Taiwan)

^b Lan Yan Institute of Technology   (Taiwan)

^c NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

^d TAMKANG UNIVERSITY   (Taiwan)

^e NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Copper sulfide; Electroless; Films; Nanocomposites; PAN; Swelling

Indexed keywords

ANCHORING EFFECTS; CHELATING AGENT; CHELATING EFFECT; CONCENTRATION OF; COPPER SULFIDES; DEPOSITED LAYER; ELECTROLESS; ELECTROLESS DEPOSITION; ELECTROMAGNETIC INTERFERENCE SHIELDING EFFECTIVENESS; EMI SHIELDING EFFECTIVENESS; ETHYLENE DIAMINE TETRA-ACETIC ACID; FT-IR SPECTRUM; HYDROGEN BONDINGS; LASER RAMAN; REDUCTION AGENTS; SWELLING DEGREE; SWELLING EFFECT; VINYL ACETATES; XRD;

ACIDS; COPPER; ELECTROLESS PLATING; ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETIC PULSE; ELECTROMAGNETIC SHIELDING; ELECTROPLATING; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HYDROGEN BONDS; MAGNETIC SHIELDING; METAL ANALYSIS; NANOCOMPOSITES; RADIATION PROTECTION; SODIUM; SPONTANEOUS EMISSION; SWELLING;

CHELATION;

COATINGS; COMPOSITE; ELECTROLESS PLATING; ELECTROMAGNETIC RADIATION; POLYACRYLONITRILE; SUBSTRATE; SWELLING;

EID: 73949088035     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.31009     Document Type: Article

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