Copper multilayer interconnection using ultravaiolet nanoimprint lithography with a double-deck mold and electroplating

Japanese Journal of Applied Physics

Volumn 48, Issue 11, 2009, Pages

  Nagai, Noriyasu ^a   Ono, Hiroshi ^a   Sakuma, Katsuyuki ^a   Saito, Mikiko ^a   Mizuno, Jun ^a   Shoji, Shuichi ^a  

^a WASEDA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAY PATTERNS; COPPER MULTILAYERS; CU ELECTROPLATING; NANO SCALE; PHOTOCURABLE RESINS; SILICON SUBSTRATES; STEP STRUCTURE; TRENCH PATTERNS; ULTRAVIOLET-NANOIMPRINT LITHOGRAPHY;

ELECTROPLATING; MOLDS; NANOSTRUCTURED MATERIALS; OXIDE MINERALS; QUARTZ; RESINS;

NANOIMPRINT LITHOGRAPHY;

EID: 73849148739     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.48.115001     Document Type: Article

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