Rapid prototyping of LTCC microwave circuits using laser machining

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2009, Pages 469-472

  Shafique, M Farhan ^a   Robertson, Ian D ^a  

^a UNIVERSITY OF LEEDS   (United Kingdom)

Author keywords

Laser machining; LTCC; Microwave circuits; Multi chip modules; Screen printing

Indexed keywords

BAND PASS; CONDUCTOR WIDTHS; COUPLED LINES; LASER MACHINING; LASER POWER; LASER PROTOTYPING; LOW COST METHODS; LTCC TECHNOLOGY; RESEARCH AND DEVELOPMENT; RING RESONATOR;

BANDPASS FILTERS; CONCURRENT ENGINEERING; ETCHING; INSULATING MATERIALS; JOB ANALYSIS; MACHINING; MICROWAVE CIRCUITS; MICROWAVE DEVICES; PRINTING PRESSES; RAPID PROTOTYPING; SCREEN PRINTING;

MICROWAVES;

EID: 73049096455     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2009.5165735     Document Type: Conference Paper

References (7)

1. th int. spring seminar on electronics technology., pp. 162-168, May 2005.
2. C. Zhang, D. Liu, S. A. Mathews, J. Graves, T. M. Gilbert, R. Modi, H. Wu, and D. B. Chrisey, "Laser direct-write and its application in low temperature co-fired ceramic(LTCC) technology," Microelectronic Engineering, vol. 70, no. 12, pp. 41-49, October. 2003.
3. A. Pietriková, S. Slosar ík, M. Bujaloboková, P. Cabúk, and I. Vehec, "Chosen electrical and reliability properties of thick film photoimageable components," 28th int. spring seminar on electronics technology, pp. 407-412, May 2005.
4. J. Kita, A. Dziedzic, L.J. Golonka, A. Bochenek,"Properties of laser cut LTCC heaters", Microelectronic .Reliability, vol. 40, no. 6, pp. 1005-1010, June 2000.
5. J. Kita, A. Dziedzic, L. J. Golonka, T. Zawada, "Laser treatment of LTCC for 3D structures," Microelectronics International, vol. 19, issue 3, pp. 14-18, 2002.
6. th intl. spring seminar on electronics technology, pp. 55-63, May 2006.
7. K. M. Nowak, H. J. Baker, D. R. Hall, "Cold processing of LTCC with CO2 laser," Applied Physics A, vol.84, no. 3, pp 267-270 August 2006.