Chosen electrical and reliability properties of thick film photoimageable components

28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005

Volumn 2005, Issue , 2005, Pages 407-412

  Pietriková, Alena ^a   Slosarčík, Stanislav ^a   Bujaloboková, Magdaléna ^a   Cabúk, Pavol ^a   Vehec, Igor ^a  

^a TECHNICAL UNIVERSITY OF KO ICE   (Slovakia)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTORS; ELECTRIC INDUCTORS; ELECTRIC PROPERTIES; MULTILAYERS; RELIABILITY;

MULTILAYER STRUCTURES; PHOTOIMAGEABLE TECHNOLOGY; RELIABILITY PROPERTIES; RELIABILITY TESTS;

THICK FILMS;

EID: 33745457182     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2005.1491063     Document Type: Conference Paper

References (7)

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2. Dziurdzia, B., Magoński Z., Nowak, S., Cie, M., Gregorczyk, W., Niemyjski, W.: Photoimageable thick-film microwave structures up to 18 GHz, Electron Technology Internet Journal
3. Terry, R. Suess, Michael, A., Skurski: Fodel, Photoprintable Thick Film; Materials and Processing, DuPont company Process Guidelines For Fodel on Green Tape; DuPont Microcircuit Materials
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6. www.prz.rzeszow.pl/imaps2001/artykul e.html
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