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Volumn , Issue , 2006, Pages 55-63
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Realization of μ-vias in LTCC tape
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Author keywords
[No Author keywords available]
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Indexed keywords
AUTOMOBILE ELECTRONIC EQUIPMENT;
AUTOMOBILE PARTS AND EQUIPMENT;
BUILDING MATERIALS;
CERAMIC MATERIALS;
COBALT;
ELECTRONICS PACKAGING;
FORMING;
LASERS;
NEODYMIUM;
OPTICAL DESIGN;
PULSED LASER DEPOSITION;
PUNCHING;
SPRINGS (COMPONENTS);
TECHNOLOGY;
THICK FILMS;
WELL DRILLING;
WELL STIMULATION;
(140.3500) LASERS;
(2+1) DIMENSIONS;
(OTDR) TECHNOLOGY;
CIRCUIT COMPLEXITY;
CIRCUIT DIMENSIONS;
CONFERENCE PROCEEDINGS;
ELECTRICAL PERFORMANCES;
ELECTRONICS TECHNOLOGY;
HIGH-FREQUENCY (HF);
INTERNATIONAL (CO);
KEY TECHNOLOGIES;
LASER DRILLING;
LINE WIDTHS;
LOW TEMPERATURE CO-FIRED CERAMIC (LTCC);
LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) TECHNOLOGY;
LOW-TEMPERATURE CO-FIRED CERAMIC (LTCC) MATERIALS;
NANO TECHNOLOGIES;
NEW APPLICATIONS;
PACKAGING DENSITIES;
PHOTOIMAGEABLE THICK FILM TECHNOLOGY;
PRODUCTION PROCESSES;
TELECOMMUNICATIONS MARKETS;
VIA HOLES;
VOLUME PRODUCTIONS;
ELECTRONIC EQUIPMENT MANUFACTURE;
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EID: 46449114725
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ISSE.2006.365359 Document Type: Conference Paper |
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Times cited : (11)
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References (10)
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