Reduced thermal stress in composites via negative thermal expansion particulate fillers

Composites Science and Technology

Volumn 70, Issue 2, 2010, Pages 318-327

  Miller, W ^a   Smith, C W ^a   Dooling, P ^b   Burgess, A N ^b   Evans, K E ^a  

^a UNIVERSITY OF EXETER   (United Kingdom)

^b AKZONOBEL   (United Kingdom)

Author keywords

A. Particle reinforcement; B. Thermal properties; C. Finite element analysis; Negative thermal expansion

Indexed keywords

COMPOSITE FILLERS; COMPOSITE FORMULATIONS; ELECTRONIC CHIPS; ENGINEERING APPLICATIONS; FINITE ELEMENT ANALYSIS; FINITE ELEMENT MODELLING; NEGATIVE POISSON'S RATIOS; NEGATIVE THERMAL EXPANSION; PARTICLE REINFORCEMENT; PARTICLE SEPARATION DISTANCE; PARTICLE-MATRIX INTERACTIONS; PARTICLE-MATRIX INTERFACE; PARTICULATE FILLERS; POISSON'S RATIO; THEORETICAL STUDY; THERMAL EXPANSIVITY; THERMAL MISMATCH; THERMAL PROPERTIES; YOUNG'S MODULUS;

BUOYANCY; FILLERS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; POISSON DISTRIBUTION; POISSON EQUATION; POISSON RATIO; REINFORCEMENT; THERMAL EFFECTS; THERMAL STRESS;

THERMAL EXPANSION;

COMPOSITE; FILLING MATERIAL; FINITE ELEMENT ANALYSIS; INTERFACIAL PROPERTY; MATHEMATICAL MODEL; STRESS; THERMAL EXPANSION; THERMAL PROPERTY; YOUNG MODULUS;

EID: 72949098080     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2009.11.003     Document Type: Article

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