Finite element analysis of stress singularities in attached flip chippackages

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 4, 2000, Pages 301-305

  Xu, A Q ^a   Nied, H F ^a  

^a Lehigh University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000157073     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.1289768     Document Type: Article

References (8)

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3. Gradin, P. A., 1982, “A fracture criterion for edge-bonded bimaterial bodies,” J. Compos. Mater., 16, pp. 448-456.
4. Groth, H. L., 1988, “Stress singularities and fracture at interface corners in bonded joints,” Int. J. Adhesion Adhesives, 8, pp. 107-113.
5. Reedy, Jr., E. D., and Guess, T. R., 1993, “Comparison of butt tensile strength data with interface corner stress intensity factor prediction,” Int. J. Solids Struct., 30, No. 21, pp. 2929-2936.
6. Yamada, Y. and Okumura, H., 1983, “Analysis of local stress in composite materials by the 3d finite element,” Kawata, K., and Akasaka, T., eds., Proc. of the Japan-U.S. Conference, 1981, pp. 55-64.
7. Lehoucq, R. B., Sorensen, D. C., and Yang, C. 1997, ARPACK Users Guide: Solution of Large Scale Eigenvalue Problems by Implicitly Restarted Arnoldi Methods, http://www.caam.rice.edu/software/ARPACK/.
8. Palmer, C. I., and Leigh, C. W., eds., 1925, Plane and Sperical Trigonometry, 3rd ed., McGraw-Hill, New York.