Properties of solders and their fatigue in power modules

Microelectronics Reliability

Volumn 42, Issue 9-11, 2002, Pages 1641-1646

  Lefranc, G ^a   Licht, T ^b   Mitic, G ^a  

^a SIEMENS AG   (Germany)

^b Eupec GmbH and Co KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POWER SYSTEMS; RATE CONSTANTS; SOLDERING ALLOYS; STRAIN; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

COEFFICIENTS OF THERMAL EXPANSIONS; HEATING AND COOLING RATES; POWER MODULE; SOLDER FATIGUE; SOLDER LAYERS; TEMPERATURE CYCLING; THERMAL TIME CONSTANTS;

STRAIN RATE;

EID: 33645608441     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00203-2     Document Type: Conference Paper

References (12)

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12. Lefranc G., Licht T., Schultz H.J., Beinert R., Mitic G., Reliability testing of high-power multi-chip IGBT modules, Proc. ESREF 2000, Dresden