Packaging of high temperature 50 kW SiC motor drive modules for hybrid-electric vehicles

Proceedings - 2009 International Symposium on Microelectronics, IMAPS 2009

Volumn , Issue , 2009, Pages 663-670

  McPherson, B ^a   Hornberger, J ^a   Bourne, J ^a   Lostetter, A ^a   Schupbach, R ^a   Shaw, R ^a   Reese, B ^a   Rowden, B ^b   Mantooth, A ^b   Ang, S ^b   Balda, J ^b   Okumura, K ^c   Otsuka, T ^c  

^a Arkansas Power Electronics International Inc   (United States)

^b UNIVERSITY OF ARKANSAS   (United States)

^c ROHM CO LTD   (Japan)

Author keywords

High temperature; Power electronics packaging; Silicon Carbide (SiC)

Indexed keywords

HIGH TEMPERATURE; HIGH-TEMPERATURE PACKAGING; INTEGRATED MOTOR DRIVES; POWER ELECTRONICS SYSTEMS; SILICON CARBIDES (SIC); TRANSIENT LIQUID PHASE; VOLTAGE BLOCKING CAPABILITY; WIDE-BAND-GAP SEMICONDUCTOR;

CHIP SCALE PACKAGES; ELECTRIC DRIVES; ELECTRIC VEHICLES; MICROELECTRONICS; POWER ELECTRONICS; SEMICONDUCTOR DEVICE MANUFACTURE;

SILICON CARBIDE;

EID: 72149089203     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

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