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Volumn 485, Issue 1-2, 2009, Pages 98-103
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Systematic corrosion investigation of various Cu-Sn alloys electrodeposited on mild steel in acidic solution: Dependence of alloy composition
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Author keywords
Corrosion; Cu Sn electrodeposition; Electrochemical impedance spectroscopy; Energy dispersive X ray analysis
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Indexed keywords
ACIDIC SOLUTIONS;
ALLOY COATINGS;
ALLOY COMPOSITIONS;
ALLOY DEPOSITION;
ALLOY FILM;
CONSTANT TEMPERATURE;
COPPER-TIN ALLOY;
CORROSION BEHAVIOUR;
CU-SN ALLOYS;
CU-SN ELECTRODEPOSITION;
ELECTROCHEMICAL IMPEDANCE SPECTROMETRY;
ELECTROCHEMICAL POLARIZATION MEASUREMENT;
GALVANOSTATICALLY ELECTRODEPOSITED;
MILD STEEL;
SEM;
SN RATIO;
SULPHURIC ACID MEDIUM;
TIME GRADIENTS;
ALLOYING;
ALLOYS;
CARBON STEEL;
COPPER;
COPPER ALLOYS;
CORROSION RESISTANCE;
ELECTROCHEMICAL CORROSION;
ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY;
ELECTRODEPOSITION;
MEASUREMENT THEORY;
METAL ANALYSIS;
METALLIC FILMS;
REFRACTORY ALLOYS;
SCANNING ELECTRON MICROSCOPY;
SULFURIC ACID;
TIN;
X RAY DIFFRACTION;
X RAY DIFFRACTION ANALYSIS;
TIN ALLOYS;
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EID: 72049089017
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2009.05.150 Document Type: Article |
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Times cited : (28)
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References (26)
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