Production of low cost contacts and joins for large area devices by electrodeposition of Cu and Sn

Applied Surface Science

Volumn 168, Issue 1-4, 2000, Pages 292-295

  Ferreira, J ^a   Seiroco, H ^a   Braz Fernandes, F ^a   Martins, R ^a   Fortunato, E ^a   Marvao A P ^b   Martins, J I ^c  

^a DEPARTAMENTO DE CIÊNCIA DOS MATERIAIS   (Portugal)

^b CSP   (Portugal)

^c UNIVERSITY OF PORTO   (Portugal)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRODEPOSITION; INTERFACES (MATERIALS); INTERMETALLICS; MORPHOLOGY; SOLDERING; WETTING;

METALLURGICAL ALLOYS;

COPPER ALLOYS;

EID: 0034514366     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(00)00627-9     Document Type: Article

References (3)

1. Gonçalves C., Ferreira J., Fortunato E., Ferreira I., Marvão R., Martins A.P., Martins J.I., Harder T., Oppelt R. Sens. Actuators A. 74:1999;70.
2. J. Ferreira, F. Braz Fernandes, C. Gonçalves, P. Nunes, E. Fortunato, R. Martins, J.I. Martins, A.P. Marvão, Mater. Sci. Eng., 2000, in press.
3. D.F. Bernier, in: Proceedings of the Internepcon China'86 on Soldering Electronic Assemblies.