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Volumn , Issue , 2009, Pages 1222-1225

CMUT-in-CMOS ultrasonic transducer arrays with on-chip electronics

Author keywords

3D imaging; CMUT; Transducer array; Ultrasound

Indexed keywords

2D ARRAYS; 3D IMAGING; CAVITY SEALING; CMOS PROCESSS; ON-CHIP BUFFERS; ON-CHIP ELECTRONICS; POST PROCESS; SACRIFICIAL ETCHING; SIGNAL CONDITIONING; SINGLE CHIPS; TRANSDUCER ARRAY; ULTRASONIC TRANSDUCER ARRAY; ULTRASOUND TRANSDUCER ARRAYS;

EID: 71449127772     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2009.5285878     Document Type: Conference Paper
Times cited : (16)

References (5)
  • 2
    • 8344253627 scopus 로고    scopus 로고
    • Low Temperature Fabrication of Immersion Capacitive Micromachined Ultrasonic Transducers on Silicon and Dielectric Substrates
    • J. Knight, J. McLean, F. L. Degertekin, "Low Temperature Fabrication of Immersion Capacitive Micromachined Ultrasonic Transducers on Silicon and Dielectric Substrates", IEEE Trans. on Ultrasonics, Ferroelectrics, and Freq. Cont., vol. 51, pp. 1324-1333, 2004.
    • (2004) IEEE Trans. on Ultrasonics, Ferroelectrics, and Freq. Cont , vol.51 , pp. 1324-1333
    • Knight, J.1    McLean, J.2    Degertekin, F.L.3
  • 5
    • 0033899427 scopus 로고    scopus 로고
    • Micromachined Ultrasound Transducers with improved coupling factors from a CMOS compatible process
    • P-C. Eccardt and K. Niederer, "Micromachined Ultrasound Transducers with improved coupling factors from a CMOS compatible process", Ultrasonics, vol. 38, pp. 774-780, 2000.
    • (2000) Ultrasonics , vol.38 , pp. 774-780
    • Eccardt, P.-C.1    Niederer, K.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.