Template based high packing density assembly for microchip solid state cooling application

3rd Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2006

Volumn , Issue , 2006, Pages 54-58

  Wang, Kerwin ^a   Baskaran, Rajashree ^a   Böhringer, Karl F ^b  

^a INTEL CORPORATION   (United States)

^b University of Washington   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPONENT SIZE; HIGH DENSITY; HIGH PACKING DENSITY; SHAPE MATCHING; SOLID-STATE COOLING; TEMPLATE-BASED; THERMOELECTRIC COOLING; VAN DER WAALS ATTRACTION;

VAN DER WAALS FORCES;

NANOSCIENCE;

EID: 84874715439     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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