High speed I/O and thermal effect characterization of 3D stacked ICs

2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Volumn , Issue , 2009, Pages

  Groger, Moishe ^a   Harb, Shadi M ^a   Morris, Devin ^a   Eisenstadt, William R ^a   Puligundla, Sudeep ^b  

^a J Crayton Pruitt Family Department of Biomedical Engineering   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

3D technology; CML; Crosstalk; GTL driver; High speed design; I O; ISI; Signal integrity; Stacked ICs

Indexed keywords

3D TECHNOLOGY; CMOS TECHNOLOGY; CONTROL LOGIC; DATA PATTERNS; DIFFERENT FREQUENCY; DIFFERENTIAL SIGNAL; ELECTRICAL MODELS; EYE DIAGRAMS; HIGH CURRENTS; HIGH SPEED DESIGNS; HIGH SPEED I/O; HIGH-SPEED SIGNALS; I/O DRIVERS; ON CHIPS; SIGNAL INTEGRITY; SPEED DIFFERENTIAL; SYSTEM IMPLEMENTATION; THERMAL PERFORMANCE; THROUGH SILICON VIAS; TRANSIENT SIMULATION; WORK FOCUS;

AUTOMOBILE DRIVERS; CMOS INTEGRATED CIRCUITS; CROSSTALK; INTERSYMBOL INTERFERENCE; JITTER; SIMULATORS; SPEED;

THREE DIMENSIONAL;

EID: 70549105981     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2009.5306528     Document Type: Conference Paper

References (11)

1. Val, C., "New Approaches to 3-D Interconnection System in Package Applications", IMAPS 2003, 36th International Symposium of Microelectronics, Boston, Nov. 18-20, 2003, pp. 229-234
2. Al-sarawi, S. F. Abbott, D., and Franzon, P. D, "A Review of 3D Packaging Technology," IEEE transactions on Component, Packaging, and Manufacturing Technology - Part B, Vol. 21, No. 1, (1998), pp. 2-14
3. Freedam, M., "MCM interconnection options", Proc NEPCON West, Anaheim, CA, 1991, p. 1527
4. Tanskanen, J, Toikka, J, and Ristolainen, E. O., "Crosstalk of Wiring in Very Small 3D Module:, IMAPS 2003, 36th International Symposium of Microelectronics, Boston, Nov. 18-20, 2003, pp. 251-255
5. S.H. Hall, G.W. Hall, and J.A. McCall, High-Speed Digital System Design, John Wiley & Sons, 2000
6. G. Gerosa, S. Gary, C. Dietz, Dac Pham, K. Hoover, J. Alvarez, H. Sanchez, P. Ippolito, Tai Ngo, S. Litch, J. Eno, J Golab, N. Vandeschaaf, J. Kahle, "A 2.2 W, 80 MHz Superscalar RISC Microprocessor, " IEEE Journal of Solid-State Circuits, vol. 29. No. 12, December 1994
7. B. A. Chappell, T. I. Chappell, S. E. Schuster, H.M. Segmuller, J.W. Allan, R.L. Franch, and P.J. Restle, "Fast CMOS ECL Receivers With 100-mV ," Worst-Case Sensitivity," IEEE Journal of Solid-State Circuits, vol23, no.1, pp. 59-67, February 1988.
8. Yiming Zhai; Prakash, S.B.; Cohen, M.H.; Abshire, P.A. "Detection of on-chip temperature gradient using a 1.5V low power CMOS temperature sensor," ISCAS 2006. Proceedings. 2006 IEEE International Symposium on, pp. 1171 - 1174.
9. Filanovsky, I.M.; Su Tam Lim, "Temperature sensor applications of diode-connected MOS transistors," ISCAS 2002. IEEE International Symposium on Volume 2, 26-29 May 2002 Page(s):II-149 - II-152 vol. 2.
10. Szajda, K.S.; Sodini, C.G.; Bowman, H.F., "Low noise, high resolution silicon temperature sensor," Solid-State Circuits, IEEE Journal of, Volume 31, Issue 9, Sept. 1996 Page(s):1308 - 1313.
11. Luh, L.; Choma, J., Jr.; Draper, J.; Chiueh, H., "A high-speed CMOS on-chip temperature sensor," Solid-State Circuits Conference, 1999. ESSCIRC '99. Proceedings of the 25th European, 21-23 Sept. 1999 Page(s):290 - 293.