Dynamical X-ray microscopy study of stress-induced voiding in Cu interconnects

AIP Conference Proceedings

Volumn 1143, Issue , 2009, Pages 20-30

  Heim, S ^a   Friedrich, D ^a,b,c   Guttmann, P ^a   Rehbein, S ^a   Chumakov, D ^c   Ritz, Y ^c   Schneider, G ^a   Schmeisser, D ^b   Zschech, E ^c  

^a HAHN MEITNER INSTITUT   (Germany)

^b BRANDENBURG UNIVERSITY OF TECHNOLOGY   (Germany)

^c GLOBALFOUNDRIES   (Germany)

Author keywords

Copper interconnects; Stress migration; X ray microscopy

Indexed keywords

EID: 70450218919     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.3169261     Document Type: Conference Paper

References (14)

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