Modeling of nanostructured polymer-metal composite for thermal interface material applications

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 481-484

  Hu, Zhili ^a,b   Carlberg, Björn ^b   Yue, Cong ^a   Guo, Xingming ^a   Liu, Johan ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

EFFECTIVE THERMAL CONDUCTIVITY; EXPERIMENTAL DATA; INTERFACE TEMPERATURES; MODELING AND SIMULATION; NANOSTRUCTURED POLYMERS; SURFACE IMAGE; THERMAL INTERFACE MATERIALS; VOLUME PERCENTAGE;

CARBON FIBER REINFORCED PLASTICS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; PACKAGING; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMOANALYSIS;

CONDUCTING POLYMERS;

CARBON FIBERS; ELECTRONICS; PACKAGING; POLYMERS; REINFORCED PLASTIC; SIMULATION; THERMAL ANALYSIS; THERMAL CONDUCTIVITY; THERMAL INSULATION;

EID: 70450073248     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270706     Document Type: Conference Paper

References (9)

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