A novel gap narrowing process for creating high aspect ratio transduction gaps for MEM HF resonators

Materials Research Society Symposium Proceedings

Volumn 1139, Issue , 2009, Pages 13-18

  Stoffels, S ^a,b   Bryce, G ^a   VanHoof, R ^a   Du Bois, B ^a   Mertens, R P ^a,b   Puers, R ^b   Tilmans, H A C ^a   Witvrouw, A ^a  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

AIR-GAPS; HIGH FREQUENCY; HIGH-ASPECT RATIO; HIGH-ASPECT-RATIO-ETCHING; LOW TEMPERATURES; MECHANICAL RESONATORS; NOVEL TECHNIQUES; PROCESSING STEPS; SILICON GERMANIUM; STRUCTURAL LAYERS; TECHNOLOGY USE; THICK LAYERS; WIDE GAP;

BICMOS TECHNOLOGY; GERMANIUM; MEMS; MICROELECTROMECHANICAL DEVICES; PHOTORESISTS; PRESSURE DROP; RESONATORS; SEMICONDUCTING GERMANIUM COMPOUNDS; SILICON ALLOYS;

ASPECT RATIO;

EID: 70449567737     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. C.T.C. Nguyen, IEEE trans. Ultrason., Ferroelect, Freq. Contr., vol. 54, no. 2, pp. 251-270, Feb. 2007
2. H.A.C. Tilmans, J. of Micromechanics and Microengineering, Vol. 7, pp. 285-309, 1997
3. J. R. Clark, W.-T. Hsu, and C. T.-C. Nguyen, Technical Digest, IEEE IEDM, Dec. 11-13, 2000, pp. 399-402.
4. S. Pourkamali, F. Ayazi, Technical Digest, MEMS 2004, pp. 813-816
5. A. E. Franke, et. al. IEEE/ASME Journal of MEMS, 12, 160-171 (2003).
6. A. Schreurle, et. al., Proc. IEEE MEMS 07, pp. 39-42.
7. H.C. Lin, etal, J. Electrochem. Soc., vol. 141 No. 9 (09/1994), pp. 2559-2563.
8. S. Sedky, Proc. MRS, Vol. 729 (2002), pp. 205-213
9. F. Laermer, A. Schilp, K. Funk, M. Offenberg, Technical Digest MEMS'99, pp. 211-216, Florida, USA, 1999.