Parylene C and silicone as biocompatible protection encapsulants for PCBs

ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings

Volumn , Issue , 2009, Pages

  Bellmann, C ^a   Beshchasna, N ^a   Uhlemann, J ^a   Wolter, K J ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BEST CHOICE; ENCAPSULANTS; IMPLANTABLE MEDICAL DEVICES; LONG TERM; LOW WEIGHT; NEURAL PROSTHESIS; OPTICAL SIGNALS; PARYLENE C; PHYSIOLOGICAL CONDITION; PHYSIOLOGICAL FLUIDS; PROTECTION MATERIAL; SILICONE RUBBER;

POLYCHLORINATED BIPHENYLS; PRINTED CIRCUITS; TIN;

SILICONES;

EID: 70449567342     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2009.5206975     Document Type: Conference Paper

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