Surface degradation of Sn-contained electronic packaging materials in simulated body fluids

2008 31st International Spring Seminar on Electronics Technology: Reliability and Life-time Prediction, ISSE 2008

Volumn , Issue , 2008, Pages 656-661

  Beshchasna, N ^a   Engelien, E ^a   Uhlemann, J ^a   Wolter, K J ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BLOOD PLASMA; CEREBRO SPINAL FLUIDS; CHEMICAL COMPOSITIONS; DYNAMICAL INTERACTIONS; ELECTRONIC MATERIALS; ELECTRONIC MEDICAL DEVICES; ELECTRONIC PACKAGING MATERIAL; FUNCTIONAL PROPERTIES; HOT AIR; HUMAN BODIES; HUMAN BODY FLUIDS; HYDROLYTIC STABILITY; LABORATORY CONDITIONS; MASS LOSS; NACL SOLUTION; PARYLENE C; SIMULATED BODY FLUIDS; SN-3.5AG; SOAKING TIME; STABILITY TESTING; SURFACE DEGRADATION; SURFACE RATIO;

AIR; BLOOD; DEGRADATION; ELECTRONICS PACKAGING; MATERIALS TESTING; PACKAGING MATERIALS; SILVER; SODIUM CHLORIDE; SURFACE TOPOGRAPHY; TIN;

SURFACES;

EID: 71449110825     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2008.5276583     Document Type: Conference Paper

References (13)

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