Why gold flash can be detrimental to long-term reliability

Journal of Electronic Packaging

Volumn 126, Issue 1, 2004, Pages 37-40

  Xie, Jingsong ^a   Sun, Ming ^a   Pecht, Michael ^a   Barbe, David F ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; COSTS; DEGRADATION; ELECTRIC CONDUCTIVITY; POROSITY; RELIABILITY; STRESS ANALYSIS;

GOLD FLASHING; MIXED FLOWING GAS (MFG); PLATING TECHNOLOGY; SUB-SECTIONS;

ELECTRIC CONNECTORS;

EID: 8744220344     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1646425     Document Type: Article

References (22)

1. Bhagath, S., and Pecht, M., 1994, "Probing Connector Reliability," Connector Specifier, June, pp. 32-34.
2. Peel, M., 1996, "Gold Flash Contacts: Super Saver or Ticking Time Bomb," Proceedings of the Technical Program: NEPCON East'96, Boston, Massachusetts, June, pp. 17-33.
3. Abys, J. A. et al., 1999, "Palladium-Cobalt Makes a Superior Finish," Connector Specifier, February, pp. 12-14.
4. Geckle, R. J., and Mroczkowski, R. S., 1990, "Corrosion of Precious Metal Plated Copper Alloys due to Mixed Flowing Gas Exposure," 1990 36th IEEE Holm Conference on Electrical Contacts and the 15th International Conference on Electric Contacts, Montreal, Que., Canada, August, pp. 193-202.
5. Chao, J. L., and Gore, R. R., 1991, "Evaluation of a Mixed Flowing Gas Test," 1991 Proceedings of the Thirty-Seventh IEEE Holm Conference on Electrical Contacts, Chicago IL, October, pp. 216-228.
6. Antler, M., 1982, "Field Studies of Contact Materials: Contact Resistance Behavior of Some Base and Noble Metals," IEEE Trans. Compon., Hybrids, Manuf, Technol., CHMT-5(3), September, pp. 301-307.
7. Abbott, W. H., 1987, "Corrosion of Porous Gold Plating in Field and Laboratory Environments," Plat. Surf. Finish., 74(11), November, pp. 72-75.
8. Abbott, W. H., 1987, "The Development and Performance Characteristics of Mixed Flowing Gas Test Environments," 1987 Proceeding of the Thirty-third IEEE Holm Conference on Electrical Contacts, Chicago, IL, September, pp. 63-78.
9. Gore, R. R., Witska, R., Kirby, J. R., and Chao, J. L., 1990, "Corrosion Gas Environmental Testing for Electrical Contact," IEEE Trans. Compon., Hybrids, Manuf. Technol., 13(1), March, pp. 27-32.
10. Lees, P. W., 1996, "A Comparison of Electroplated Gold Flash PalladiumNickel and Wrought, Clad Inlay WE#1 Capped Palladium-Silver," Proceedings of the Technical Program: NEPCON East'96, Boston, MA, June, pp. 45-59.
11. Bell Communications Research, 1995, "Generic Requirements for Separable Electrical Connectors Used in Telecommunications Hardware," Generic Requirements GR-12I7-CORE, November, Issue 1.
12. ASTM B810-96, 2000, "Test Methods for Calibration of Atmospheric Corrosion Test Chambers by Change in Mass of Copper Coupons," 2000 Annual Book of ASTM Standards, Vol.02.04, pp. 916-920.
13. ASTM B827-97, 2000, "Standard Practice for Conducting Mixed Flowing Gas (MFG) Environmental Tests," 2000 Annual Book of ASTM Standards, Vol.02.04, pp. 971-979.
14. ASTM B845-97, 2000, "Standard Guide for Mixed Flowing Gas (MFG) Tests for Electrical Contacts." 2000 Annual Book of ASTM Standards, Vol.02.04. pp. 996-1006.
15. Uhlig. H. H., 1965, Corrosion and Corrosion Control-M Introduction to Corrosion Science and Engineering, John Wiley & Sons Inc., New York.
16. Tomashov, N. D., 1966, Theory of Corrosion and Protection of Mutais; the Science of Corrosion, Macmillan Company, New York.
17. Conrad, L. R., Pike-Biequnski, M. J., and Freed, R. L., 1982, "Creep Corrosion Over Gold, Palladium and Tin-Lead Electroplate," 15th Annual Connectors and Interconnection Technology Symposium Proceedings, Philadelphia. PA, November, pp. 401-414.
18. Williams, D. W. M., 1987, "The Effect of Test Environment on the Creep of Base Metal Surface Films over Precious Metal Inlays," Proceedings of the 33rd Meeting of the IEEE Holm Conference on Electrical Contacts, Chicago. IL, September, pp. 79-85.
19. Rau, J. W., Graham, A. H., and Guerra, V., 1987, "Thermal Stability and Substrate Dependent Creep Corrosion of Palladium-Nickel Alloy With a Soft Gold Flash," Proceedings of the Technical Program of the National Electronic Packaging and Production Conference-NEPCON West '87, Anaheim, CA, February, Vol. 2, pp. 754-769.
20. Runde, M., 1987, "Mass Transport in Stationary Contact Points," IEEE Trans. Compon., Hybrids, Manuf. Technol., CHMT-lO(l), March, pp. 89-99.
21. Tompkins, H. G., and Pinnel, M. R., 1976, "Low-Temperature Diffusion of Copper Through Gold," J. Appl. Phys., 47(9), September, pp. 3804-3812.
22. Tierney, V., 1981, "The Nature and Rate of Creep of Copper Sulfide Tarnish Film Over Gold," J. Electrochem. Soc., June, pp. 1321-1326.