Will future RFIC be flexible?

2009 IEEE 10th Annual Wireless and Microwave Technology Conference, WAMICON 2009

Volumn , Issue , 2009, Pages

  Ma, Zhenqiang ^a   Sun, Lei ^a  

^a University of Wisconsin Madison   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE MATERIAL; FABRICATION TECHNOLOGIES; FLEXIBLE ELECTRONICS; FLEXIBLE SUBSTRATE; LOW FREQUENCY; NANOMEMBRANES; OPERATION FREQUENCY; PLASTIC SUBSTRATES; POLY-CRYSTALLINE SILICON; RF COMPONENTS; RF DEVICES; RF-CIRCUITS; SINGLE-CRYSTAL SI;

CARRIER MOBILITY; FABRICATION; FREQUENCY CONVERTER CIRCUITS; MICROWAVE DEVICES; MICROWAVES; MILITARY APPLICATIONS; NANOSTRUCTURES; ORGANIC POLYMERS; POLYCRYSTALLINE MATERIALS; POLYSILICON; SUBSTRATES; TECHNOLOGY;

AMORPHOUS SILICON;

EID: 70449348154     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/WAMICON.2009.5207245     Document Type: Conference Paper

References (12)

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