Effective diffusion barrier metallization process on copper

Thin Solid Films

Volumn 376, Issue 1-2, 2000, Pages 164-169

  So, William W ^a   Choe, Selah ^a   Chuang, Ricky ^a   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ENERGY DISPERSIVE SPECTROSCOPY; HEAT CONDUCTION; INTERDIFFUSION (SOLIDS); JOINTS (STRUCTURAL COMPONENTS); METALLIZING; SOLDERING; STRAIN; STRESS ANALYSIS;

BARRIER METALLIZATION PROCESS;

SEMICONDUCTING FILMS;

EID: 0034315362     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(00)01212-8     Document Type: Article

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